Title:
RETAINER, TOP RING, AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/145117
Kind Code:
A1
Abstract:
The present invention aims to reduce the frequency of retainer replacements. A retainer disposed so as to surround a holding region 39 for a polygonal substrate WF, in a top ring for holding the polygonal substrate WF in a state in which a surface to be polished is facing downwards. The retainer 30 includes a plurality of retainer main bodies 3 that are disposed on the perimeter of the holding region 39 so as follow each edge of the polygonal substrate WF, independently. At least one of the plurality of retainer main bodies 3 includes: a first fixing surface (first surface 3a) that can be fixed to a top ring retainer holding member 37; a first facing surface (second surface 3b) that faces the holding region 39 in a first state in which the first fixing surface is fixed to the retainer holding member 37; a second fixing surface (third surface 3c) that can be fixed to the retainer holding member 37 in a second state in which the retainer main body 3 is rotated 180° from the first state; and a second facing surface (fourth surface 3d) that faces the holding region 39 in a state in which the second fixing surface is fixed to the retainer holding member 37.
Inventors:
ISHII YU (JP)
Application Number:
PCT/JP2021/039069
Publication Date:
July 07, 2022
Filing Date:
October 22, 2021
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/32; H01L21/304
Foreign References:
| JP2000052242A | 2000-02-22 | |||
| JP2008137108A | 2008-06-19 | |||
| JP2020163529A | 2020-10-08 | |||
| JP3123851U | 2006-07-27 | |||
| JP2020218340A | ||||
| JP2020163529A | 2020-10-08 | |||
| JP2014176950A | 2014-09-25 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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