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Patent Searching and Data


Title:
RETENTION DEVICE AND RETENTION METHOD
Document Type and Number:
WIPO Patent Application WO/2012/172957
Kind Code:
A1
Abstract:
This retention device (10) is provided with: a first suction part (11) that sucks at a wafer (substrate) (2) on the side to which dicing tape (support membrane) (3) adheres; a structure (14) that supports a dicing frame (4) and also covers a first region sandwiched between the wafer (2) and the dicing frame (4) on the surface of the side of the dicing tape (3) to which the wafer (2) does not adhere; and a second suction part (12) that at least seals between the structure (14) and either the dicing frame (4) or the first region.

Inventors:
MIYANARI ATSUSHI
Application Number:
PCT/JP2012/063561
Publication Date:
December 20, 2012
Filing Date:
May 25, 2012
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
MIYANARI ATSUSHI
International Classes:
H01L21/683; H01L21/301; H01L21/304
Foreign References:
JP2010239026A2010-10-21
JPH11186133A1999-07-09
JPH08206570A1996-08-13
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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Claims: