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Title:
RF TAG
Document Type and Number:
WIPO Patent Application WO/2016/170750
Kind Code:
A1
Abstract:
The purpose of the invention is to enable wireless communication over a plurality of different frequency bands by layering and arranging an auxiliary antenna on an inlay that includes an IC chip and an antenna, and making both the antenna of the inlay and the auxiliary antenna function effectively while protecting the inlay and the auxiliary antenna from the external environment by housing the same in, for example, a predetermined housing. This RF tag comprises: an inlay 10 including an IC chip 11 and an antenna 12; an auxiliary antenna 20 layered on the inlay 10 in an insulated state; and a housing 50 that houses therein said inlay 10 on which the auxiliary antenna 20 has been layered. The antenna 12 of the inlay 10 forms a loop part 11a in the vicinity of the IC chip 11. The auxiliary antenna 20 is arranged so as to overlap a portion of the loop part 11a, and is arranged along the length direction of the inlay 10 such that at least a portion of the antenna 12 of the inlay 10 is exposed.

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Inventors:
AKAMATSU SHINYA (JP)
SHIMIZU HIRONAGA (JP)
Application Number:
PCT/JP2016/001968
Publication Date:
October 27, 2016
Filing Date:
April 11, 2016
Export Citation:
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Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
International Classes:
H01Q19/22; G06K19/077; H01Q1/24
Domestic Patent References:
WO2007139205A12007-12-06
Foreign References:
JP2014006810A2014-01-16
JP2013250797A2013-12-12
JP2013114513A2013-06-10
JP2009182446A2009-08-13
US20120068826A12012-03-22
JP2006053833A2006-02-23
JP2007272264A2007-10-18
JP2011109552A2011-06-02
JP2010508794A2010-03-18
Other References:
See also references of EP 3288114A4
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
Patent business corporation HEIWA INTERNATIONAL PATENT (JP)
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