Title:
RFID INLAY AND RFID LABEL
Document Type and Number:
WIPO Patent Application WO/2019/009066
Kind Code:
A1
Abstract:
The RFID inlay according to one embodiment of the present invention is provided with: an IC chip; a first conductive film that constitutes a loop antenna electrically connected to the IC chip; and a second conductive film that constitutes a booster antenna separated from the first conductive film. The second conductive film has at least one hole.
Inventors:
NITTA SHINYA (JP)
FAIZ ADI EZARUDIN BIN ADIB (JP)
FAIZ ADI EZARUDIN BIN ADIB (JP)
Application Number:
PCT/JP2018/023389
Publication Date:
January 10, 2019
Filing Date:
June 20, 2018
Export Citation:
Assignee:
SATO HOLDINGS KK (JP)
International Classes:
G06K19/077; G09F3/00; H01Q1/38; H01Q7/00; H01Q19/02
Foreign References:
| JP2009015563A | 2009-01-22 | |||
| JP2010268023A | 2010-11-25 | |||
| JP2015069499A | 2015-04-13 | |||
| JP2002259920A | 2002-09-13 | |||
| JP2008041005A | 2008-02-21 |
Attorney, Agent or Firm:
GLOBAL IP TOKYO (JP)
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