Title:
RFID TAG
Document Type and Number:
WIPO Patent Application WO/2019/221211
Kind Code:
A1
Abstract:
The present invention provides an RFID tag which has high fastness. This RFID tag (1) is provided with: a substrate (100) for RFID tags, on which a semiconductor integrated circuit is mounted; a resin member (20) which holds the substrate for RFID tags; and a buffer member (30) which holds the resin member. The buffer member (30) has an outer peripheral part (31) and an intermediate part (32) which is positioned closer to the center than the outer peripheral part, and which is configured such that the relative distance between itself and the outer peripheral part is variable by means of elasticity; and the resin member (20) is held by the intermediate part (32).
Inventors:
YAMASHITA KOJI (JP)
Application Number:
PCT/JP2019/019427
Publication Date:
November 21, 2019
Filing Date:
May 16, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
G06K19/077; H01Q13/08
Domestic Patent References:
| WO2018101315A1 | 2018-06-07 |
Foreign References:
| JP2014067234A | 2014-04-17 | |||
| US20130200164A1 | 2013-08-08 | |||
| JP2012118811A | 2012-06-21 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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