Title:
RFID TAG
Document Type and Number:
WIPO Patent Application WO/2021/039398
Kind Code:
A1
Abstract:
This RFID tag comprises: a film wiring substrate including a flexible base material having a first surface and a second surface located opposite to the first surface, and conductors located on the first and second surfaces, respectively; and an RFIC IC connected to the conductors, wherein the film wiring substrate 10 is bent, and at least a first conductor part included in the conductor on the first surface, a second conductor part included in the conductor on the first surface or the second surface, and a conductor on the second surface that does not include the second conductor part overlap each other.
Inventors:
YAMAMOTO SHUICHI (JP)
Application Number:
PCT/JP2020/030672
Publication Date:
March 04, 2021
Filing Date:
August 12, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
G06K19/077; H01Q1/38; H01Q13/08
Domestic Patent References:
| WO2018016624A1 | 2018-01-25 |
Foreign References:
| JPH11168406A | 1999-06-22 | |||
| JP2003022912A | 2003-01-24 | |||
| US20090160653A1 | 2009-06-25 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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