Title:
RICE FLOUR–BASED TEMPURA FLOUR COMPOSITION AND FOOD PROCESSING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/034267
Kind Code:
A3
Abstract:
[Problem] To provide a rice flour–based tempura flour composition that does not include wheat flour, and a food processing method using the composition. [Solution] This rice flour–based tempura flour composition is characterized by comprising 2 parts by weight of silicon, 0.8–1.5 parts by weight of baking powder, 1.1–2.5 parts by weight of a sugar ester, 15–19.2 parts by weight of starch, 70.5–76 parts by weight of rice flour, 3.5–6.3 parts by weight of calcium lactate, and 0.05 parts by weight of carotene. The present invention also provides a food processing method using the composition.
Inventors:
WATANABE YOSHIAKI (JP)
Application Number:
PCT/JP2017/029287
Publication Date:
April 12, 2018
Filing Date:
August 14, 2017
Export Citation:
Assignee:
WATANABEYOKO CO LTD (JP)
M TECHX INC (JP)
M TECHX INC (JP)
International Classes:
A23L7/157; A23L5/10; C08K3/08; C08K5/098; C08L1/10; C08L3/02
Domestic Patent References:
| WO2014087730A1 | 2014-06-12 |
Foreign References:
| JPS58162252A | 1983-09-26 | |||
| JPH05244883A | 1993-09-24 | |||
| JPS4919054A | 1974-02-20 | |||
| JP2012135225A | 2012-07-19 | |||
| JP2010104246A | 2010-05-13 | |||
| JP2013034440A | 2013-02-21 | |||
| JP2015084682A | 2015-05-07 |
Other References:
FUJIKAWA MAMORU ET AL.: "Development of new use of rice "OIDEMAI"- Use as frying powder", RESEARCH REPORT OF INDUSTRIAL TECHNOLOGY CENTER IN KAGAWA PREFECTURE, no. 14, 2014, pages 75 - 77, ISSN: 1346-5236
HITOMI ET AL.: "The physical properties and sensory evaluation of bread and tempura using "komeko"", ANNUAL REPORT, FACULTY OF HUMAN SCIENCES, vol. 14, 2012, pages 69 - 77
HITOMI ET AL.: "The physical properties and sensory evaluation of bread and tempura using "komeko"", ANNUAL REPORT, FACULTY OF HUMAN SCIENCES, vol. 14, 2012, pages 69 - 77
Attorney, Agent or Firm:
OPUS IP LAW FIRM (JP)
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