Title:
RIGID-FLEX CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/093400
Kind Code:
A1
Abstract:
A manufacturing method for a rigid-flex circuit board, comprising the following steps: providing a first wiring board and a first substrate, and pressing the first substrate on the surface of the first wiring board by means of a first adhesive layer, the first substrate comprising a second base layer pressed on the surface of the first adhesive layer, a protection layer formed on the surface of the second base layer, and a first copper layer formed on the surface of the protection layer; causing the first copper layer to form a third conductive wiring layer; partially covering the protection layer exposed by the third conductive wiring layer and removing the protection layer exposed by the third conductive wiring layer and a covered region; providing a second copper layer, and pressing the second copper layer on the surface of the third conductive wiring layer by means of a second adhesive layer, the second copper layer and the second adhesive layer both being subjected to a pre-windowing process to form a window region, the window region being located at the remaining protection layer; removing the protection layer at the window region; and causing the second copper layer to form a fifth conductive wiring layer. The present invention further provides a rigid-flex circuit board.
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Inventors:
HOU NING (CN)
LI WEIXIANG (CN)
LI WEIXIANG (CN)
Application Number:
PCT/CN2018/114914
Publication Date:
May 14, 2020
Filing Date:
November 09, 2018
Export Citation:
Assignee:
QING DING PREC ELECTRONICS HUAIAN CO LTD (CN)
AVARY HOLDING SHENZHEN CO LTD (CN)
AVARY HOLDING SHENZHEN CO LTD (CN)
International Classes:
H05K1/02; H05K3/36
Foreign References:
| CN106332438A | 2017-01-11 | |||
| CN105472906A | 2016-04-06 | |||
| CN1659310A | 2005-08-24 | |||
| US9204561B2 | 2015-12-01 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO.,LTD. (CN)
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