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Patent Searching and Data


Title:
RINSE AGENT COMPOSITION FOR SILICON WAFERS
Document Type and Number:
WIPO Patent Application WO/2018/116631
Kind Code:
A1
Abstract:
This rinse agent composition for silicon wafers contains: a water-soluble polymer A that has a constituent unit A having a betaine structure; and an aqueous medium. It is preferable that the water-soluble polymer A contains a constituent unit represented by formula (1). It is preferable that the water-soluble polymer additionally contains a constituent unit B represented by formula (2). The weight average molecular weight of the water-soluble polymer A is preferably from 1,000 to 3,000,000 (inclusive). This rinse agent composition for silicon wafers may contain a pH adjusting agent, if necessary.

Inventors:
UCHIDA Yohei
Application Number:
JP2017/038763
Publication Date:
June 28, 2018
Filing Date:
October 26, 2017
Export Citation:
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Assignee:
KAO CORPORATION (14-10, Nihonbashi Kayabacho 1-chome Chuo-k, Tokyo 10, 〒1038210, JP)
International Classes:
H01L21/304; C11D7/22; C11D17/08
Domestic Patent References:
WO2004042812A12004-05-21
WO2012039390A12012-03-29
Foreign References:
JP2016056220A2016-04-21
Attorney, Agent or Firm:
IKEUCHI SATO & PARTNER PATENT ATTORNEYS (26th Floor, OAP TOWER 8-30, Tenmabashi 1-chome, Kita-ku, Osaka-sh, Osaka 26, 〒5306026, JP)
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