Title:
ROBOT DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/207552
Kind Code:
A1
Abstract:
A robot device according to this technology is equipped with a clamp mechanism, a transport mechanism, and a control unit. The clamp mechanism has a first finger (11) and a second finger (12). The first finger (11) has: a first support surface (110) one end of which is fixed and the other end of which can support a wire group, which is composed of a plurality of wires, having a terminal part that can be connected to a connection part, in a state in which the wire group is aligned; and an accommodation section (11c) that is connected with the first support surface (110) and that has a guide wall for restricting the amount of movement of the wire group in the alignment direction. The second finger (12) has: a second support surface (120) that faces the first support surface (110); and a facing section (12c) that is connected with the second support surface (120) and that faces the accommodation section (11c). The transport mechanism is configured so as to be capable of moving the clamp mechanism. The control unit controls the grip force of the clamp mechanism for gripping the wire group, and the direction of movement of the clamp mechanism moved by the transport mechanism.
Inventors:
TAKEYAMA SHINICHI (JP)
BEPPU HIROKUNI (JP)
BEPPU HIROKUNI (JP)
Application Number:
PCT/JP2018/015518
Publication Date:
November 15, 2018
Filing Date:
April 13, 2018
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
B25J15/08; B25J13/08
Domestic Patent References:
| WO2017046975A1 | 2017-03-23 |
Foreign References:
| JP2005011580A | 2005-01-13 | |||
| JP2015030086A | 2015-02-16 | |||
| JP2014176917A | 2014-09-25 | |||
| JP2013022672A | 2013-02-04 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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