Title:
ROBOT SYSTEM, MACHINING METHOD OF ROBOT, AND MACHINING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/013559
Kind Code:
A1
Abstract:
A robot system 100 comprises: a robot 1 for machining a machining portion B of an object W; a storage unit 32 for keeping an image of the object W, and three-dimensional information; a designation device 9 for designating the machining portion B in the image; and a control device 3 for controlling the robot 1. The control device 3, on the basis of the portion in the image designated by the designation device 9 and the three-dimensional information, derives the machining portion B in the three-dimensional information, and causes the robot 1 to machine the machining portion B by operating the robot 1 on the basis of the three-dimensional information of the machining portion B.
More Like This:
| WO/2002/006586 | METHOD FOR GRINDING A RAIL AND DEVICE FOR CARRYING OUT SAID METHOD |
| WO/2024/083063 | WAFER POLISHING SYSTEM |
Inventors:
AZUMA KENTARO
AKAMATSU MASAHIKO
KOZUKI TAKANORI
KINOSHITA HIROKI
HASUNUMA HITOSHI
KURASHIMA KAZUKI
NISHIO SHOICHI
TANAKA HIROKI
TAKAHASHI HIROKI
AKAMATSU MASAHIKO
KOZUKI TAKANORI
KINOSHITA HIROKI
HASUNUMA HITOSHI
KURASHIMA KAZUKI
NISHIO SHOICHI
TANAKA HIROKI
TAKAHASHI HIROKI
Application Number:
PCT/JP2022/029381
Publication Date:
February 09, 2023
Filing Date:
July 29, 2022
Export Citation:
Assignee:
KAWASAKI HEAVY IND LTD (JP)
International Classes:
B24B27/00; B24B49/02; B24B49/12; B25J13/00
Foreign References:
| JP2014075050A | 2014-04-24 | |||
| JP2010182210A | 2010-08-19 | |||
| JP2018004497A | 2018-01-11 | |||
| JP2020017111A | 2020-01-30 |
Attorney, Agent or Firm:
TERAZONO Kenichi et al. (JP)
Download PDF: