Title:
ROLLED COPPER OR COPPER-ALLOY FOIL PROVIDED WITH ROUGHENED SURFACE
Document Type and Number:
WIPO Patent Application WO/2012/132576
Kind Code:
A1
Abstract:
This rolled copper or copper-alloy foil provided with a roughened surface is a rolled copper or copper-alloy foil which is roughened by forming fine copper particles and which is characterized by being provided with a base plating layer of copper between the roughened copper layer and the rolled copper or copper-alloy foil. Thus, a roughened rolled copper-alloy foil with fewer craters is provided, craters being a significant disadvantage unique to a rolled copper-alloy foil provided with a roughened surface. In particular, a rolled copper or copper-alloy foil which can minimize the occurrence of craters caused by inclusions present either in the surface layer of a base metal or in the neighborhood thereof is provided.
Inventors:
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2012/053106
Publication Date:
October 04, 2012
Filing Date:
February 10, 2012
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
International Classes:
C25D7/06; C25D5/10; H05K1/09; H05K3/38
Domestic Patent References:
| WO2011138876A1 | 2011-11-10 |
Foreign References:
| JP2002241989A | 2002-08-28 | |||
| JP2010037585A | 2010-02-18 | |||
| JP2009164488A | 2009-07-23 |
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
Isamu Ogoshi (JP)
Download PDF:
Claims:
Previous Patent: SHOWER PLATE, VAPOR-PHASE GROWTH APPARATUS, AND VAPOR-PHASE GROWTH METHOD
Next Patent: COPPER FOIL FOR PRINTED CIRCUIT
Next Patent: COPPER FOIL FOR PRINTED CIRCUIT