Title:
ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, METHOD FOR PRODUCING COPPER-CLAD LAMINATE, METHOD FOR PRODUCING FLEXIBLE PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/014172
Kind Code:
A1
Abstract:
Provided is a rolled copper foil that has higher flexibility than conventional products when made into an FPC. Rolled copper foil containing 99.9 mass% or more of Cu, the balance being unavoidable impurities, and the arithmetic mean value of the Taylor factor being 2.485 or less as measured at a total of three points including a discretionary point and two points each spaced equidistantly 5 mm therefrom in a direction perpendicular to the rolling direction when heat treated for a heating holding time of 30 minutes at a dryer internal temperature of 260°C.
Inventors:
NAKAGAWA KOTARO (JP)
OTA AKIMITSU (JP)
CHO SHUNSUKE (JP)
OTA AKIMITSU (JP)
CHO SHUNSUKE (JP)
Application Number:
PCT/JP2023/020561
Publication Date:
January 18, 2024
Filing Date:
June 01, 2023
Export Citation:
Assignee:
JX METALS CORP (JP)
International Classes:
C22C9/00; C22F1/08; H05K1/02; H05K1/03; H05K1/09; C22F1/00
Domestic Patent References:
| WO2013021970A1 | 2013-02-14 |
Foreign References:
| JP2011094200A | 2011-05-12 | |||
| JP2000256765A | 2000-09-19 | |||
| JP2012243454A | 2012-12-10 | |||
| JP2014214376A | 2014-11-17 | |||
| JP2013044005A | 2013-03-04 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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