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Title:
ROLLED COPPER FOIL OR ELECTROLYTIC COPPER FOIL FOR ELECTRONIC CIRCUIT AND METHOD OF FORMING ELECTRONIC CIRCUIT USING SAME
Document Type and Number:
WIPO Patent Application WO/2010/074053
Kind Code:
A1
Abstract:
A rolled copper foil or electrolytic copper foil for electronic circuits which is etched to form a circuit, characterized by including, formed on the side to be etched, a nickel alloy layer that has a lower etching rate than copper, the nickel alloy layer containing zinc. When a copper-clad laminate is subjected to circuit formation through etching of the copper foil, the etching can be prevented from resulting in an extended base and a desired circuit having an even circuit line width can be formed. The time period required for circuit formation by etching is minimized. The thickness of the nickel alloy layer has been minimized. The copper foil is inhibited from oxidizing upon heating and is prevented from suffering the discoloration commonly called "burning". The copper foil has improved suitability for pattern etching and is effective in preventing the occurrence of short circuits or circuit line width failures.

Inventors:
YAMANISHI Keisuke (Ltd. Shirogane Plant 3-3-1, Shirogane-cho, Hitachi-cit, Ibaraki 56, 〒3170056, JP)
山西 敬亮 (〒56 茨城県日立市白銀町3丁目3番1号 日鉱金属株式会社 白銀工場内 Ibaraki, 〒3170056, JP)
KAMINAGA Kengo (Ltd. Shirogane Plant 3-3-1, Shirogane-cho, Hitachi-cit, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2009/071282
Publication Date:
July 01, 2010
Filing Date:
December 22, 2009
Export Citation:
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Assignee:
Nippon Mining & Metals Co., Ltd. (10-1, Toranomon 2-chome Minato-k, Tokyo 01, 〒1050001, JP)
日鉱金属株式会社 (〒01 東京都港区虎ノ門二丁目10番1号 Tokyo, 〒1050001, JP)
YAMANISHI Keisuke (Ltd. Shirogane Plant 3-3-1, Shirogane-cho, Hitachi-cit, Ibaraki 56, 〒3170056, JP)
山西 敬亮 (〒56 茨城県日立市白銀町3丁目3番1号 日鉱金属株式会社 白銀工場内 Ibaraki, 〒3170056, JP)
International Classes:
C25D7/06; B32B15/01; C23F1/02; H05K1/09
Foreign References:
JP2005344174A2005-12-15
JP2002176242A2002-06-21
JPH08120499A1996-05-14
JP2005039097A2005-02-10
JPH0681172A1994-03-22
JP2002176242A2002-06-21
JPH05140765A1993-06-08
JPH0685416A1994-03-25
JPH0685417A1994-03-25
JPH06280047A1994-10-04
JPH0774464A1995-03-17
JPH07278883A1995-10-24
JP2005015861A2005-01-20
JP2006261270A2006-09-28
Attorney, Agent or Firm:
OGOSHI Isamu (OGOSHI International Patent Office Daini-Toranomon Denki Bldg, 5F 3-1-10 Toranomon, Minato-k, Tokyo 01, 〒1050001, JP)
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