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Title:
ROLLED COPPER FOIL OR ELECTROLYTIC COPPER FOIL FOR ELECTRONIC CIRCUIT, AND METHOD FOR FORMING ELECTRONIC CIRCUIT USING THE ROLLED COPPER FOIL OR ELECTROLYTIC COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2010/074061
Kind Code:
A1
Abstract:
Provided is a rolled copper foil or an electrolytic copper foil for an electronic circuit wherein a circuit is formed by etching. The rolled copper foil or the electrolytic copper foil is provided with: a nickel or nickel alloy layer, which is formed on the etching surface of the rolled copper foil or the electrolytic copper foil and has an etching rate lower than that of copper; and a heat-resistant layer, which is formed on the nickel or nickel alloy layer and is composed of zinc, a zinc alloy, an oxide of zinc or an oxide of the zinc alloy. At the time of forming the circuit by etching the copper foil of the copper-plated multilayer board, the target circuit having a uniform circuit width can be formed by eliminating spread etching toward the bottom, a time required for forming the circuit by etching is shortened as much as possible, the thickness of the nickel or nickel alloy layer is reduced as much as possible, discoloration commonly called "burn" is eliminated by suppressing oxidation when heat is applied, and etching performance is improved and generation of a short-circuit and a circuit width failure is eliminated in pattern etching.

Inventors:
YAMANISHI Keisuke (Ltd. Shirogane Plant 3-3-1, Shirogane-cho, Hitachi-cit, Ibaraki 56, 〒3170056, JP)
山西 敬亮 (〒56 茨城県日立市白銀町3丁目3番1号 日鉱金属株式会社 白銀工場内 Ibaraki, 〒3170056, JP)
KAMINAGA Kengo (Ltd. Shirogane Plant 3-3-1, Shirogane-cho, Hitachi-cit, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2009/071293
Publication Date:
July 01, 2010
Filing Date:
December 22, 2009
Export Citation:
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Assignee:
Nippon Mining & Metals Co., Ltd. (10-1, Toranomon 2-chome Minato-k, Tokyo 01, 〒1050001, JP)
日鉱金属株式会社 (〒01 東京都港区虎ノ門二丁目10番1号 Tokyo, 〒1050001, JP)
YAMANISHI Keisuke (Ltd. Shirogane Plant 3-3-1, Shirogane-cho, Hitachi-cit, Ibaraki 56, 〒3170056, JP)
山西 敬亮 (〒56 茨城県日立市白銀町3丁目3番1号 日鉱金属株式会社 白銀工場内 Ibaraki, 〒3170056, JP)
International Classes:
H05K3/06; B32B15/01; C23C28/00; C23F1/02; C25D5/12; C25D7/06; H05K1/09; H05K3/24
Attorney, Agent or Firm:
OGOSHI Isamu (OGOSHI International Patent Office Daini-Toranomon Denki Bldg, 5F 3-1-10 Toranomon, Minato-k, Tokyo 01, 〒1050001, JP)
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