Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ROLLED COPPER FOIL OR ELECTROLYTIC COPPER FOIL FOR ELECTRONIC CIRCUIT, AND METHOD FOR FORMING ELECTRONIC CIRCUIT USING SAME
Document Type and Number:
WIPO Patent Application WO/2010/087268
Kind Code:
A1
Abstract:
Disclosed is a rolled copper foil or electrolytic copper foil for an electronic circuit, which is formed into a circuit by etching. The rolled copper foil or electrolytic copper foil for an electronic circuit is characterized by comprising a layer of one or more metals selected from among platinum group elements, gold and silver that have a lower etching rate than the copper formed on the etching surface side of the rolled copper foil or electrolytic copper foil, or alternatively comprising an alloy layer mainly containing one or more of the above-described metals. By the rolled copper foil or electrolytic copper foil, sagging caused by etching can be prevented and a desired circuit having a uniform circuit width can be formed when the circuit is formed by etching the copper foil of a copper-clad laminate. Moreover, the time necessary for forming a circuit by etching can be reduced as much as possible, the etching performance in pattern etching can be improved, and occurrence of short-circuits or defects in circuit width can be prevented.

Inventors:
YAMANISHI KEISUKE (JP)
KAMINAGA KENGO (JP)
FUKUCHI RYO (JP)
Application Number:
PCT/JP2010/050707
Publication Date:
August 05, 2010
Filing Date:
January 21, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIPPON MINING CO (JP)
YAMANISHI KEISUKE (JP)
KAMINAGA KENGO (JP)
FUKUCHI RYO (JP)
International Classes:
H05K1/09; B32B15/01; C23C28/00; C23C30/00; C23F1/18; H05K3/06
Foreign References:
JPH06184785A1994-07-05
JP2004259940A2004-09-16
JP2001214299A2001-08-07
JP2007294873A2007-11-08
JP2002176242A2002-06-21
JP2006261270A2006-09-28
Other References:
See also references of EP 2384101A4
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
Download PDF: