Title:
ROLLED COPPER FOIL FOR FLEXIBLE PRINTED WIRING BOARD, COPPER-CLAD LAMINATED BOARD, FLEXIBLE WIRING BOARD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/070471
Kind Code:
A1
Abstract:
Provided is a rolled copper foil with which cracks do not arise in wiring even when used for a long time in wiring of a flexible printed wiring board. Also provided are a copper-clad laminated board using the same, a flexible printed wiring board, and an electronic device. When used for wiring in a flexible printed wiring board that electrically connects a first substrate and second substrate for which the difference in coefficients of linear thermal expansion is 1.2 times or greater, the rolled copper foil for a flexible printed wiring board does not give rise to cracks in the wiring even when the temperature of the flexible printed wiring board is varied -10°C - 90°C 1000 times.
Inventors:
OKANO TOMOKI (JP)
KANMURI KAZUKI (JP)
KANMURI KAZUKI (JP)
Application Number:
PCT/JP2011/076581
Publication Date:
May 31, 2012
Filing Date:
November 17, 2011
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
OKANO TOMOKI (JP)
KANMURI KAZUKI (JP)
OKANO TOMOKI (JP)
KANMURI KAZUKI (JP)
International Classes:
H05K1/09; H05K1/03; H05K1/14; H05K3/38
Foreign References:
| JP2001125127A | 2001-05-11 | |||
| JP2010239095A | 2010-10-21 | |||
| JP2008041972A | 2008-02-21 | |||
| JP2002167632A | 2002-06-11 | |||
| JP2010239081A | 2010-10-21 | |||
| JP2005317880A | 2005-11-10 | |||
| JP2003096526A | 2003-04-03 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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Claims: