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Patent Searching and Data


Title:
ROOM-TEMPERATURE-CURABLE RESIN COMPOSITION, COATING MATERIAL, ADHESIVE, SEALING MATERIAL, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/189463
Kind Code:
A1
Abstract:
A room-temperature-curable resin composition which comprises (A) 100 parts by mass of a polymer in which both ends of the molecular chain have been blocked with silanol groups or hydrolyzable silyl groups, (B) 0.1-30 parts by mass of a hydrolyzable organosilane compound represented by general formula (1) and/or a product of the partial hydrolytic condensation of the compound (in formula (1), the R1 moieties are each independently an (un)substituted monovalent hydrocarbon group having 1-12 carbon atoms, R2 is an (un)substituted monovalent hydrocarbon group having 1-12 carbon atoms, Y is a hydrolyzable group, and n is 0, 1, or 2), and (C) 0.001-20 parts by mass of a curing catalyst. The room-temperature-curable resin composition has excellent curability.

Inventors:
KATAYAMA TAIKI (JP)
FUJIWARA AKITSUGU (JP)
UTA AKIRA (JP)
YASUDA SHIGEKI (JP)
YAMADA TETSURO (JP)
HIROKAMI MUNENAO (JP)
Application Number:
PCT/JP2020/010676
Publication Date:
September 24, 2020
Filing Date:
March 12, 2020
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L101/10; C08K5/5419; C08L83/00; C09D183/00; C09D201/10; C09J183/00; C09J201/10; C09K3/10
Foreign References:
JP2004536957A2004-12-09
JP2005139452A2005-06-02
JP2009513734A2009-04-02
JP2007513203A2007-05-24
CN106634771A2017-05-10
CN108456224A2018-08-28
JP2005179587A2005-07-07
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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