Title:
ROOM-TEMPERATURE-CURABLE RESIN COMPOSITION, COATING MATERIAL, ADHESIVE, SEALING MATERIAL, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/189463
Kind Code:
A1
Abstract:
A room-temperature-curable resin composition which comprises (A) 100 parts by mass of a polymer in which both ends of the molecular chain have been blocked with silanol groups or hydrolyzable silyl groups, (B) 0.1-30 parts by mass of a hydrolyzable organosilane compound represented by general formula (1) and/or a product of the partial hydrolytic condensation of the compound (in formula (1), the R1 moieties are each independently an (un)substituted monovalent hydrocarbon group having 1-12 carbon atoms, R2 is an (un)substituted monovalent hydrocarbon group having 1-12 carbon atoms, Y is a hydrolyzable group, and n is 0, 1, or 2), and (C) 0.001-20 parts by mass of a curing catalyst. The room-temperature-curable resin composition has excellent curability.
Inventors:
KATAYAMA TAIKI (JP)
FUJIWARA AKITSUGU (JP)
UTA AKIRA (JP)
YASUDA SHIGEKI (JP)
YAMADA TETSURO (JP)
HIROKAMI MUNENAO (JP)
FUJIWARA AKITSUGU (JP)
UTA AKIRA (JP)
YASUDA SHIGEKI (JP)
YAMADA TETSURO (JP)
HIROKAMI MUNENAO (JP)
Application Number:
PCT/JP2020/010676
Publication Date:
September 24, 2020
Filing Date:
March 12, 2020
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L101/10; C08K5/5419; C08L83/00; C09D183/00; C09D201/10; C09J183/00; C09J201/10; C09K3/10
Foreign References:
JP2004536957A | 2004-12-09 | |||
JP2005139452A | 2005-06-02 | |||
JP2009513734A | 2009-04-02 | |||
JP2007513203A | 2007-05-24 | |||
CN106634771A | 2017-05-10 | |||
CN108456224A | 2018-08-28 | |||
JP2005179587A | 2005-07-07 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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