ROOM TEMPERATURE MOISTURE-CURABLE SILICONE GEL COMPOSITION, AND CURED PRODUCT AND ARTICLE THEREFROM

Title:

ROOM TEMPERATURE MOISTURE-CURABLE SILICONE GEL COMPOSITION, AND CURED PRODUCT AND ARTICLE THEREFROM

Document Type and Number:

WIPO Patent Application WO/2019/116892

Kind Code:

A1

Abstract:

Provided is a room temperature moisture-curable silicone gel composition containing:(A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof (where R2 is a monovalent hydrocarbon group, R3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa·s at 25°C, (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230°C and which has excellent heat-resistance.

Inventors:

ARAKI TADASHI (JP)
SHODA SAWAKO (JP)
YAMAGUCHI TAKAHIRO (JP)
AKIBA TOMOKI (JP)

Application Number:

PCT/JP2018/043740

Publication Date:

June 20, 2019

Filing Date:

November 28, 2018

Export Citation:

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Assignee:

SHINETSU CHEMICAL CO (JP)

International Classes:

C08L83/06; C08K5/5425

Domestic Patent References:

WO2015194340A1	2015-12-23
WO2015162962A1	2015-10-29
WO2017081850A1	2017-05-18

Foreign References:

JP2008291148A	2008-12-04
JPH01272682A	1989-10-31
JPS63268765A	1988-11-07
JPH05163438A	1993-06-29
JPS60163966A	1985-08-26
JP2008291148A	2008-12-04
JP5962599B2	2016-08-03
JP2017025232A	2017-02-02

Other References: