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Patent Searching and Data


Title:
ROTATING-LAYERING MOLD AND PRESS APPARATUS COMPRISING ROTATING-LAYERING MOLD
Document Type and Number:
WIPO Patent Application WO/2019/146686
Kind Code:
A1
Abstract:
The present invention provides a rotating-layering mold whereby a punched sheet is rotated according to a prescribed angle and layered by an upper mold and a lower mold working in tandem, and provides a press apparatus comprising the rotating-layering mold. A rotating-layering mold 201 comprises a squeeze ring 202 in which is provided a retaining hole 203 for retaining a punched sheet, the squeeze ring 202 being capable of rotating with respect to a lower mold 105 so that an upper outer circumferential surface 211 of the squeeze ring 202 lies along an inner circumferential surface 109 of the lower mold 105. The rotating-layering mold 201 further comprises a first thrust bearing, a second thrust bearing, and a radial bearing in order to support the rotation of the squeeze ring 202 with respect to the lower mold 105.

Inventors:
SUZUKI Kengo (2290 Honjo, Kikugawa-sh, Shizuoka 18, 〒4390018, JP)
Application Number:
JP2019/002240
Publication Date:
August 01, 2019
Filing Date:
January 24, 2019
Export Citation:
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Assignee:
SANKYO SEISAKUSHO CO. (37-3, Tabatashinmachi 3-chome Kita-k, Tokyo 38, 〒1148538, JP)
International Classes:
B21D28/02; B21D43/22
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, P.C. (Tennoz Central Tower, 2-2-24 Higashi-Shinagawa Shinagawa-k, Tokyo 76, 〒1408776, JP)
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