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Patent Searching and Data


Title:
ROTATING-LAYERING MOLD AND PRESS APPARATUS COMPRISING ROTATING-LAYERING MOLD
Document Type and Number:
WIPO Patent Application WO/2019/146686
Kind Code:
A1
Abstract:
The present invention provides a rotating-layering mold whereby a punched sheet is rotated according to a prescribed angle and layered by an upper mold and a lower mold working in tandem, and provides a press apparatus comprising the rotating-layering mold. A rotating-layering mold 201 comprises a squeeze ring 202 in which is provided a retaining hole 203 for retaining a punched sheet, the squeeze ring 202 being capable of rotating with respect to a lower mold 105 so that an upper outer circumferential surface 211 of the squeeze ring 202 lies along an inner circumferential surface 109 of the lower mold 105. The rotating-layering mold 201 further comprises a first thrust bearing, a second thrust bearing, and a radial bearing in order to support the rotation of the squeeze ring 202 with respect to the lower mold 105.

Inventors:
SUZUKI KENGO (JP)
Application Number:
PCT/JP2019/002240
Publication Date:
August 01, 2019
Filing Date:
January 24, 2019
Export Citation:
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Assignee:
SANKYO SEISAKUSHO KK (JP)
International Classes:
B21D28/02; B21D43/22
Foreign References:
JP2011156585A2011-08-18
JP2013010120A2013-01-17
JPS566534U1981-01-21
JP2011020132A2011-02-03
JP2013043195A2013-03-04
Other References:
See also references of EP 3744438A4
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, P.C. (JP)
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