ROUGHENED COPPER FOIL, CARRIER-ATTACHED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED WIRING BOARD

WIPO Patent Application WO/2018/211951

A1

Provided is a low-roughness roughened copper foil which is suitable for formation of a thin wire circuit, and which, when used in a SAP method, can impart, to a laminate, a surface profile that is excellent not only in etching property relative to electroless copper plating and dry film resolution but also in circuit adhesiveness. The roughened copper foil according to the present invention has a roughened surface on at least one side thereof, wherein the roughened surface has a plurality of primary roughened particles each having a narrowed part, the primary roughened particles have, on the surface having the narrowed part thereof, a plurality of secondary roughened particles that are smaller than the primary roughened particles, and a secondary roughened particle density, which is a value obtained by dividing the number of the secondary roughened particles in the narrowed part by the surface area of the narrowed part, is 9-30/μm2, and the ten-point average roughness Rz on the roughened surface is 0.7-1.7 μm.

KATO TSUBASA (JP)
MATSUDA MITSUYOSHI (JP)
IIDA HIROTO (JP)
TAKANASHI AKITOSHI (JP)
YOSHIKAWA KAZUHIRO (JP)

PCT/JP2018/017276

November 22, 2018

April 27, 2018

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MITSUI MINING & SMELTING CO (JP)

C25D7/06; B32B5/16; B32B15/04; C25D1/04; C25D5/10; C25D5/16; H05K3/18; H05K3/38

WO2016158775A1	2016-10-06
WO2016174998A1	2016-11-03
WO2017006739A1	2017-01-12

JP2011168887A

2011-09-01

TAKAMURA Masaharu et al. (JP)

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