Title:
ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/056534
Kind Code:
A1
Abstract:
Provided is a roughened copper foil for which adhesion to an insulating resin and reliability (for example, heat resistance after moisture absorption) can be significantly improved. This roughened copper foil has a roughened surface with microprotrusions and recesses configured from needle-like crystals on at least one side and the surface of the needle-like crystals overall comprises a mixed phase of Cu metal and Cu2O.
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Inventors:
MOGI SATOSHI (JP)
TSUYOSHI HIROAKI (JP)
TSUYOSHI HIROAKI (JP)
Application Number:
PCT/JP2016/061317
Publication Date:
April 06, 2017
Filing Date:
April 06, 2016
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C23C26/00; B32B15/20; C25D1/04; H05K1/09
Domestic Patent References:
WO2010110092A1 | 2010-09-30 | |||
WO2014126193A1 | 2014-08-21 | |||
WO2015111756A1 | 2015-07-30 |
Foreign References:
JP2009026491A | 2009-02-05 | |||
JP2006249519A | 2006-09-21 | |||
JP2008248269A | 2008-10-16 | |||
JP2002180157A | 2002-06-26 | |||
JP2002060866A | 2002-02-28 |
Other References:
KOTEI , SHURUI, YOTOBETSU: "Mekki Saishin Gijutsu ~Mechanism no Kosatsu to Hinshitsu Kojo~", KABUSHIKI KAISHA JOHO KIKO, 18 May 2006 (2006-05-18), pages 678 - 680
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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