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Title:
ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/056534
Kind Code:
A1
Abstract:
Provided is a roughened copper foil for which adhesion to an insulating resin and reliability (for example, heat resistance after moisture absorption) can be significantly improved. This roughened copper foil has a roughened surface with microprotrusions and recesses configured from needle-like crystals on at least one side and the surface of the needle-like crystals overall comprises a mixed phase of Cu metal and Cu2O.

Inventors:
MOGI SATOSHI (JP)
TSUYOSHI HIROAKI (JP)
Application Number:
PCT/JP2016/061317
Publication Date:
April 06, 2017
Filing Date:
April 06, 2016
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C23C26/00; B32B15/20; C25D1/04; H05K1/09
Domestic Patent References:
WO2010110092A12010-09-30
WO2014126193A12014-08-21
WO2015111756A12015-07-30
Foreign References:
JP2009026491A2009-02-05
JP2006249519A2006-09-21
JP2008248269A2008-10-16
JP2002180157A2002-06-26
JP2002060866A2002-02-28
Other References:
KOTEI , SHURUI, YOTOBETSU: "Mekki Saishin Gijutsu ~Mechanism no Kosatsu to Hinshitsu Kojo~", KABUSHIKI KAISHA JOHO KIKO, 18 May 2006 (2006-05-18), pages 678 - 680
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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