ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED WIRING BOARD

WIPO Patent Application WO/2021/193246

A1

Provided is a roughened copper foil which, when used in a copper-cladded laminate board or a printed wiring board, can achieve both of excellent transmission properties and high peel strength. The roughened copper foil has a roughened surface on at least one side thereof. The roughened surface has a microparticle tip diameter index Spk/Ssk, which is a ratio of a reduced peak height Spk (μm) which is measured in accordance with ISO25178 under the conditions where the cut-off wavelength specified by an S-filter is 0.3 μm and the cut-off wavelength specified by an L-filter is 5 μm to a skewness Ssk which is measured in accordance with ISO25178 under the conditions where the cut-off wavelength specified by an S-filter is 0.3 μm and the cut-off wavelength specified by an L-filter is 5 μm, of 0.20 to 1.00, inclusive, and also has a ten-point average height S10z of 2.50 μm or more as measured in accordance with ISO25178 under the conditions where the cut-off wavelength specified by an S-filter is 0.3 μm and the cut-off wavelength specified by an L-filter is 64 μm.

KAWAGUCHI SHOTA (JP)
TATEOKA AYUMU (TW)
KATO TSUBASA (TW)
YANG PO CHUN (TW)

PCT/JP2021/010657

September 30, 2021

March 16, 2021

Click for automatic bibliography generation  

MITSUI MINING & SMELTING CO (JP)

C25D7/06; B32B15/04; C25D1/04; C25D5/16; C25D5/48

JP2018172785A	2018-11-08
JP2018074153A	2018-05-10
JP2015148011A	2015-08-20
JP2007238968A	2007-09-20
JP2004099950A	2004-04-02
JP2005008973A	2005-01-13

TAKAMURA Masaharu et al. (JP)

View/Download PDF      PDF Help

Previous Patent: TRANSISTOR DRIVE CIRCUIT

Next Patent: GAS-BARRIER COATING COMPOSITION AND GAS-BARRIER LAMINATE