Title:
ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2011/090175
Kind Code:
A1
Abstract:
Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a resin base and good chemical resistance. A surface-roughened copper foil, which is obtained by roughening at least one face of a base copper foil (untreated copper foil) so as to increase the surface roughness (Rz) thereof, relative to the surface roughness (Rz) of said base copper foil, by 0.05-0.3 μm and has a roughened surface with a surface roughness (Rz) after roughening of 1.1 μm or less, wherein said roughened surface comprises roughed grains in a sharp-pointed convex shape which have a width of 0.3-0.8 μm, a height of 0.4-1.8 μm and an aspect ratio [height/width] of 1.2-3.5.
Inventors:
UNO TAKEO (JP)
FUJISAWA SATOSHI (JP)
FUJISAWA SATOSHI (JP)
Application Number:
PCT/JP2011/051132
Publication Date:
July 28, 2011
Filing Date:
January 21, 2011
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
UNO TAKEO (JP)
FUJISAWA SATOSHI (JP)
UNO TAKEO (JP)
FUJISAWA SATOSHI (JP)
International Classes:
C25D7/06; B32B15/01; B32B15/08; C25D5/10; H05K1/09
Foreign References:
| JP2006103189A | 2006-04-20 | |||
| JP2006210689A | 2006-08-10 | |||
| JP2007238968A | 2007-09-20 | |||
| JPH0529740A | 1993-02-05 | |||
| JP2004005588A | 2004-01-08 | |||
| JP2005344174A | 2005-12-15 | |||
| JP2006175634A | 2006-07-06 |
Attorney, Agent or Firm:
SATOH, TAKAHISA (JP)
Takahisa Sato (JP)
Takahisa Sato (JP)
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Claims: