Title:
ROUGHENED COPPER FOIL, COPPER FOIL PROVIDED WITH CARRIER, COPPER-CLAD LAMINATED SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/158775
Kind Code:
A1
Abstract:
Provided is a roughened copper foil which, when used in the SAP method, can endow a laminate with a surface profile excellent not only in plated circuit adhesion but also in etching performance for electroless copper plating and dry film resolution. This roughened copper foil has a roughened surface on at least one side, wherein: the roughened surface is provided with a plurality of substantially spherical projections composed of copper particles; the mean height of the substantially spherical projections is 2.60 μm or less; and the ratio bave/aave of the mean maximum diameter bave of the substantially spherical projections to the mean neck diameter aave of the substantially spherical projections is 1.2 or higher.
Inventors:
IIDA HIROTO (JP)
MATSUDA MITSUYOSHI (JP)
YOSHIKAWA KAZUHIRO (JP)
KAWAI NOBUYUKI (JP)
KATO TSUBASA (JP)
MATSUDA MITSUYOSHI (JP)
YOSHIKAWA KAZUHIRO (JP)
KAWAI NOBUYUKI (JP)
KATO TSUBASA (JP)
Application Number:
PCT/JP2016/059671
Publication Date:
October 06, 2016
Filing Date:
March 25, 2016
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B32B15/20; C25D7/06; C25D5/16; H05K3/18; H05K3/38
Domestic Patent References:
| WO2013047272A1 | 2013-04-04 | |||
| WO2011108467A1 | 2011-09-09 | |||
| WO2014133164A1 | 2014-09-04 |
Foreign References:
| JP2011168887A | 2011-09-01 | |||
| JP2011149067A | 2011-08-04 | |||
| JP2011219790A | 2011-11-04 | |||
| JP2015042779A | 2015-03-05 | |||
| JP2003243785A | 2003-08-29 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Masaharu Takamura (JP)
Masaharu Takamura (JP)
Download PDF: