Title:
ROUGHENED COPPER FOIL, COPPER FOIL WITH CARRIER, COPPER-CLAD MULTI-LAYER BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/188712
Kind Code:
A1
Abstract:
Provided is a roughened copper foil having low-roughness suitable for forming a thin-wire circuit and capable, when used in an SAP method, of providing a layered body with a surface profile which allows for not only excellent etching properties for electroless copper plating and excellent dry film resolution, but excellent circuit adhesion in terms of shear strength. This roughened copper foil has a roughened surface at least on one side thereof. The roughened surface is provided with multiple roughening particles, the average value of the ratio L2/S of the square of the circumferential length L (µm) of a roughening particle to the area S (µm2) of the roughening particle in a 10 µm-long cross-section of the roughened copper foil is 16 to 30, and the roughened surface has a ten-point average roughness of 0.7 µm to 1.7 µm.
Inventors:
KATO TSUBASA (JP)
MATSUDA MITSUYOSHI (JP)
IIDA HIROTO (JP)
TAKANASHI AKITOSHI (JP)
YOSHIKAWA KAZUHIRO (JP)
MATSUDA MITSUYOSHI (JP)
IIDA HIROTO (JP)
TAKANASHI AKITOSHI (JP)
YOSHIKAWA KAZUHIRO (JP)
Application Number:
PCT/JP2019/011864
Publication Date:
October 03, 2019
Filing Date:
March 20, 2019
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D7/06; B32B15/04; C25D5/10; C25D5/16; C25D1/04
Domestic Patent References:
| WO2014196576A1 | 2014-12-11 | |||
| WO2016158775A1 | 2016-10-06 | |||
| WO2018211951A1 | 2018-11-22 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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