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Patent Searching and Data


Title:
ROUGHENED COPPER FOIL, COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/031721
Kind Code:
A1
Abstract:
The present invention provides a roughened copper foil which enables the achievement of a good balance between excellent etching properties and high shear strength in processing of a copper-clad laminate or in production of a printed wiring board. This roughened copper foil has a roughened surface on at least one side; and the roughened surface has a maximum height Sz of from 0.65 μm to 1.00 μm as measured in accordance with ISO 25178, an expanded area ratio Sdr of the interface of from 1.50 to 4.20 as measured in accordance with ISO 25178, and a peak density Spd of from 6.50 × 106 peaks/mm2 to 8.50 × 106 peaks/mm2 as measured in accordance with ISO 25178.

Inventors:
HOSOKAWA MAKOTO (JP)
TAKANASHI AKITOSHI (JP)
MIZOGUCHI MISATO (JP)
HIRAOKA SHINYA (JP)
Application Number:
JP2019/029224
Publication Date:
February 13, 2020
Filing Date:
July 25, 2019
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D5/16; B32B15/04; C25D1/04; C25D7/00; C25D7/06; H05K1/09
Domestic Patent References:
WO2016117587A12016-07-28
Foreign References:
JP2005048277A2005-02-24
JP2018026590A2018-02-15
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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