Title:
ROUGHENING SOLUTION FOR ROLLED COPPER FOIL AND METHOD FOR PRODUCING ROUGHENED COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2023/090306
Kind Code:
A1
Abstract:
The present invention provides an aqueous composition for roughening the surface of a rolled copper foil, the aqueous composition containing hydrogen peroxide (A), sulfuric acid (B) and an azole compound (C) and/or a salt thereof, wherein: the content of the hydrogen peroxide (A) in the aqueous composition is 0.1% by mass to 5% by mass based on the total mass of the aqueous composition; the content of the sulfuric acid (B) in the aqueous composition is 0.5% by mass to 15% by mass based on the total mass of the aqueous composition; the content of the azole compound (C) in the aqueous composition is 0.01% by mass to 0.3% by mass based on the total mass of the aqueous composition; the molar ratio of the hydrogen peroxide (A) to the sulfuric acid (B) in the aqueous composition, the molar ratio being expressed by (hydrogen peroxide)/(sulfuric acid), is within the range of 0.1 to 1.0; and the azole compound (C) is composed of at least one compound that is selected from the group consisting of benzotriazole compounds and tetrazole compounds. The present invention also provides: a method for roughening a copper foil and a method for producing a roughened copper foil, each using the aqueous composition; and a roughened copper foil, and a flexible printed wiring board using the roughened copper foil.
Inventors:
SONE MASAMI (JP)
MATSUNAGA HIROSHI (JP)
TAMAI SATOSHI (JP)
MATSUNAGA HIROSHI (JP)
TAMAI SATOSHI (JP)
Application Number:
PCT/JP2022/042331
Publication Date:
May 25, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C23F1/18; H05K1/09
Domestic Patent References:
| WO2011099624A1 | 2011-08-18 |
Foreign References:
| JP2002256459A | 2002-09-11 | |||
| JP2008144232A | 2008-06-26 | |||
| JP2014013883A | 2014-01-23 | |||
| CN111349937A | 2020-06-30 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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