Title:
RUBBER COMPOSITION FOR TIRE
Document Type and Number:
WIPO Patent Application WO/2019/044889
Kind Code:
A1
Abstract:
Provided are: a rubber composition for a tire, the rubber composition being capable of producing a crosslinked product having excellent mechanical strength such as wear resistance; said crosslinked product; a tire tread partially using said composition or said crosslinked product, the tire tread having improved rolling resistance (fuel efficiency) and being capable of achieving improved steering stability; a bead filler; a tire belt; and a pneumatic tire. The rubber composition for a tire contains 0.1-50 parts by mass of a modified liquid diene-based rubber (B) having a functional group derived from a silane compound having a specific structure, and 20-200 parts by mass of a filler (C) with respect to 100 parts by mass of a solid rubber (A) having a glass transition temperature (Tg) of -10°C or lower, wherein the modified liquid diene-based rubber (B) satisfies (i)-(iv): (i) a weight average molecular weight (Mw) of 15,000-120,000; (ii) a vinyl content of 70 mol% or less; (iii) 1-30 functional groups on average per one molecule of the modified liquid diene-based rubber (B); and (iv) a glass transition temperature of 0°C or lower.
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Inventors:
KANBARA HIROSHI (JP)
KODA DAISUKE (JP)
KODA DAISUKE (JP)
Application Number:
PCT/JP2018/031912
Publication Date:
March 07, 2019
Filing Date:
August 29, 2018
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08L15/00; B60C1/00; B60C15/06; C08K3/04; C08K3/36; C08L7/00; C08L9/00
Domestic Patent References:
WO2018043699A1 | 2018-03-08 | |||
WO2018043700A1 | 2018-03-08 |
Foreign References:
JP2013249359A | 2013-12-12 | |||
JPS61197646A | 1986-09-01 | |||
JP2016113588A | 2016-06-23 | |||
JP2016028235A | 2016-02-25 | |||
JP2016060789A | 2016-04-25 | |||
JPS62112618A | 1987-05-23 | |||
JP2000219778A | 2000-08-08 | |||
JP2014012768A | 2014-01-23 | |||
JP2011132298A | 2011-07-07 |
Other References:
See also references of EP 3677635A4
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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