Title:
RUBBER GRAFT COPOLYMER, AND THERMOPLASTIC RESIN COMPOSITION CONTAINING RUBBER GRAFT COPOLYMER
Document Type and Number:
WIPO Patent Application WO/2013/157569
Kind Code:
A1
Abstract:
The present invention relates to a thermoplastic resin composition which contains a rubber graft copolymer composed of a core layer comprising a rubbery polymer and a shell layer grafted to the core layer and a thermoplastic resin composed of a polycarbonate resin and an aliphatic polyester resin at a (rubber graft copolymer)/(thermoplastic resin) ratio of 3/100 or more by mass, said thermoplastic resin composition being characterized in that the shell layer is a layer produced by homopolymerizing or copolymerizing a (meth)acrylate monomer having an epoxy group and the amount of the (meth)acrylate monomer having an epoxy group is 3 parts by mass or more and less than 29 parts by mass relative to 100 parts by mass of the rubber graft copolymer.
The present invention can be utilized in, for example, electric/electronic applications including a personal computer, a liquid crystal display, a projector, a PDA, a printer, a copy machine, a facsimile, a video camera, a digital camera, a portable phone (a smartphone), a portable audio apparatus, a game machine, a DVD recorder, a microwave oven, a rice cooker, and the like; constructional applications including a road light-transmitting plate, a lighting window, a car port, an illumination lens, an illumination cover, an architectural sizing, a door and the like; vehicular applications including a handle, a shift lever, a window for an automobile or an electric train which is made from a vibration-proofing material, a display, an illumination lamp, a driver seat panel and the like; and others.
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Inventors:
TAKAMIDO SEIGO (JP)
FUJIMOTO TOYOHISA (JP)
FUJIMOTO TOYOHISA (JP)
Application Number:
PCT/JP2013/061374
Publication Date:
October 24, 2013
Filing Date:
April 17, 2013
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L69/00; C08F6/22; C08F279/02; C08L51/04; C08L67/00
Domestic Patent References:
| WO2008102536A1 | 2008-08-28 |
Foreign References:
| JP2007211108A | 2007-08-23 | |||
| JP2000204128A | 2000-07-25 | |||
| JP2010222553A | 2010-10-07 | |||
| JP2005048067A | 2005-02-24 | |||
| JPH11240995A | 1999-09-07 | |||
| JP2007112829A | 2007-05-10 | |||
| JP2007277368A | 2007-10-25 | |||
| JPH11158365A | 1999-06-15 | |||
| JP2010222553A | 2010-10-07 |
Other References:
See also references of EP 2840116A4
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
Hisakazu Ueki (JP)
Hisakazu Ueki (JP)
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