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Patent Searching and Data


Title:
RUBBER-MADE SUPPORT DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/077884
Kind Code:
A1
Abstract:
Provided is a rubber-made support device such that while there exists an upward raising force counteracting function, the thickness and the width can be reduced, resulting in compactness being achieved. Cutouts (4) which extend in the bridge axis direction are provided in upper end corners of an upper end steel plate (3a) disposed on the upper end surface of a rubber laminated body (2). Upper end protrusions (7a) of side blocks (7) are provided opposite the cutouts (4), with gaps provided in-between. When an upward raising force acts, the cutouts (4) are made to abut the upper end protrusions (7a), with the result that this arrangement is made to function as an upward raising force counteracting device. Gaps (g1) formed in the direction perpendicular to the bridge axis direction, between the cutouts (4) and the upper end protrusions (7a), are set to be smaller than gaps (2g) formed in the direction perpendicular to the bridge axis direction, between those side surfaces of the rubber laminated body (2) where rubber layers (5) exist and the inner side surfaces (7c) of the side blocks (7), said side surfaces (7c) being opposite said side surfaces of the rubber laminated body (2). As a result, when a force perpendicular to the bridge axis acts, one of the cutouts (4) and one of the upper end protrusions (7a) are made to abut each other.

Inventors:
HATANO,Hitoshi (Hiratsuka Factory, 2-1, Oiwake, Hiratsuka-sh, Kanagawa 01, 〒2548601, JP)
Application Number:
JP2010/070877
Publication Date:
June 30, 2011
Filing Date:
November 24, 2010
Export Citation:
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Assignee:
THE YOKOHAMA RUBBER CO.,LTD. (36-11, Shimbashi 5-chome Minato-k, Tokyo 85, 〒1058685, JP)
横浜ゴム株式会社 (〒85 東京都港区新橋5丁目36番11号 Tokyo, 〒1058685, JP)
International Classes:
E01D19/04
Attorney, Agent or Firm:
OGAWA,Shin-ichi et al. (Seiryu International Patent Office, 37 Kowa Building 4-5, Tsukiji 1-chome, Chuo-k, Tokyo 45, 〒1040045, JP)
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