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Title:
RUBBER SHEET MONITORING APPARATUS AND RUBBER SHEET MONITORING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/216371
Kind Code:
A1
Abstract:
This rubber sheet monitoring apparatus (1) comprises a first imaging unit (11), a second imaging unit (13), a first generation unit (142), and a second calculation unit (146). The first imaging unit sequentially acquires images of the first optical cutting edge (CL1) formed on the obverse surface of a rubber sheet (6). The second imaging unit sequentially acquires images of the second optical cutting edge (CL2) formed on the reverse surface of the rubber sheet. The first generation unit performs, on each of the sequentially acquired first optical cutting edge images, a process to generate first data (D1) indicating the height distribution of cross sections along the width direction of the rubber sheet by using the images of the first optical cutting edge, and performs, on each of the sequentially acquired second optical cutting edge images, a process for generating second data (D2) indicating the height distribution of the cross sections along the width direction of the rubber sheet by using the images of the second optical cutting edge. The second calculation unit calculates, on the basis of first data and second data for the same cross section, the thickness of the rubber sheet in the cross section.

Inventors:
TAKAHASHI, Eiji
MANABE, Chitaka
KONISHI, Akira
MIURA, Hodaka
Application Number:
JP2018/014868
Publication Date:
November 29, 2018
Filing Date:
April 09, 2018
Export Citation:
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Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) (2-4 Wakinohama-Kaigandori 2-chome, Chuo-ku Kobe-sh, Hyogo 85, 〒6518585, JP)
International Classes:
B65H43/04; B65H26/02; G01B11/04; G01B11/06; G01B11/30
Foreign References:
JP2014153123A2014-08-25
JP2010025586A2010-02-04
JP2013039782A2013-02-28
JPS59114681A1984-07-02
JPH06221838A1994-08-12
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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