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Patent Searching and Data


Title:
RUN-FLAT TIRE
Document Type and Number:
WIPO Patent Application WO/2014/141880
Kind Code:
A1
Abstract:
Provided is a run-flat tire that achieves a high dimension of both run-flat durability and riding comfort, and enables the improvement of steering stability during normal traveling. In the side-reinforced run-flat tire, the relationship between the rim width (Wr) and the distance (Do) to the tire equator plane from the center position of a peripheral-direction primary groove positioned to the outermost side in the widthwise direction of the tire in the outside region of the vehicle is 0.20 ≤ Do/Wr ≤ 0.30, the relationship between the rim width (Wr) and the distance (Di) to the tire equatorial plane from the center position of a peripheral-direction primary groove positioned to the outermost side in the widthwise direction of the tire in the inside region of the vehicle is 0.25 ≤ Di/Wr ≤ 0.35, the relationship between the groove width (Wi) of the peripheral-direction primary groove positioned at the outermost side in the widthwise direction of the tire at the inside region of the vehicle and the groove width (Wo) of the peripheral-direction primary groove positioned at the outermost side in the widthwise direction of the tire at the outside region of the vehicle is 0.80 ≤ Wo/Wi ≤ 0.90, the relationship between the thickness (Ga) at a rim check line position of an outside rubber portion at the outside of a carcass layer and the greatest thickness (Gb) of same is 0.8×Gb ≤ Ga ≤ 1.0×Gb, and the relationship between the thickness (Gc) at the rim check line position of an inside rubber portion at the inside of the carcass layer and the thickness (Ga) is 0.7×Ga ≤ Gc ≤1.0×Ga.

Inventors:
HORIUCHI, Kenji (Hiratsuka Factory, 2-1, Oiwake, Hiratsuka-sh, Kanagawa 01, 〒2548601, JP)
Application Number:
JP2014/054628
Publication Date:
September 18, 2014
Filing Date:
February 26, 2014
Export Citation:
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Assignee:
THE YOKOHAMA RUBBER CO., LTD. (36-11, Shimbashi 5-chome Minato-k, Tokyo 85, 〒1058685, JP)
International Classes:
B60C11/04; B60C5/00; B60C13/00; B60C17/00
Domestic Patent References:
WO2014042035A12014-03-20
Foreign References:
JP2012116212A2012-06-21
JP2010132236A2010-06-17
JP2009126409A2009-06-11
JP2012096656A2012-05-24
Attorney, Agent or Firm:
SEIRYU PATENT PROFESSIONAL CORPORATION et al. (37 Kowa Building, 4-5 Tsukiji 1-chome, Chuo-k, Tokyo 45, 〒1040045, JP)
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