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Title:
SACRIFICIAL PLASTIC MOLD WITH ELECTROPLATABLE BASE AND ASSOCIATED METHOD OF MANUFACTURE
Document Type and Number:
WIPO Patent Application WO2002057516
Kind Code:
A3
Abstract:
A sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation or a thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold. Upon casting or cooling and demolding, the porous metal substrate is embedded within the cast formulation and projects a plastic structure with features determined by the mold tool. The plastic structure provides a sacrificial plastic mold mechanically bonded to the porous metal substrate, which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved, leaving the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

Inventors:
DOMEIER LINDA A
HRUBY JILL M
MORALES ALFREDO M
GONZALES MARCELA G
KEIFER PATRICK M
Application Number:
PCT/US2002/001565
Publication Date:
July 24, 2003
Filing Date:
January 17, 2002
Export Citation:
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Assignee:
SANDIA CORP (US)
International Classes:
B29C33/00; B29C33/38; B29C33/52; C25D1/10; (IPC1-7): C25D1/10
Foreign References:
US3535211A1970-10-20
US5055163A1991-10-08
US4981558A1991-01-01
US5073237A1991-12-17
Other References:
DATABASE WPI Section Ch Week 200260, Derwent World Patents Index; Class M11, AN 2002-564665, XP002241261
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