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Patent Searching and Data


Title:
SAMPLE EXPANSION/CONTRACTION AMOUNT MEASURING SYSTEM AND SAMPLE EXPANSION/CONTRACTION AMOUNT MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/137448
Kind Code:
A1
Abstract:
There is provided a thermal expansion amount measuring system capable of accurately measuring a thermal expansion from a sample piece of micro size, which can be applied to a MEMS device. A sample (10) is sandwiched between a sample table (11) and one end of an inclined translucent mirror (12) and heated at a constant in a heating furnace (13) at a predetermined temperature increase speed. Here, the interference light generated between the sample table (11) and the inclined translucent mirror (12) is observed by using a confocal scan type laser microscope. Since the inclination angle of the inclined translucent mirror (12) is changed by the expansion by the heated sample (10), the interference fringe interval is also changed. By accurately measuring the change of the interference fringe interval, it is possible to accurately measure the thermal expansion of the sample (10).

Inventors:
MIURA SEIJI
OKA KAZUHIKO
MOHRI TETSUO
OHKUBO KENJI
Application Number:
PCT/JP2006/312427
Publication Date:
December 28, 2006
Filing Date:
June 21, 2006
Export Citation:
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Assignee:
UNIV HOKKAIDO NAT UNIV CORP (JP)
MIURA SEIJI
OKA KAZUHIKO
MOHRI TETSUO
OHKUBO KENJI
International Classes:
G01N25/16; G01B11/16; G01N21/45
Foreign References:
JPH0161189B21989-12-27
JPS59216003A1984-12-06
JPS488265A
JPH07294466A1995-11-10
JP2005017134A2005-01-20
JPH04366744A1992-12-18
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (2-6 Tenjinbashi 2-chome, Kita, Kita-k, Osaka-shi Osaka 41, JP)
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