SAMPLE ARRAYING/ASSEMBLING DEVICE, ITS METHOD, AND APPARATUS USING SAMPLE ASSEMBLY

Title:

SAMPLE ARRAYING/ASSEMBLING DEVICE, ITS METHOD, AND APPARATUS USING SAMPLE ASSEMBLY

Document Type and Number:

WIPO Patent Application WO/2004/113918

Kind Code:

A1

Abstract:

A sample arraying/assembling device adapted to any type of microplate conforming to the International Standards and capable of arraying/assembling any of various types of samples quickly with high efficiency. Its method and an apparatus using a sample assembly are also disclosed. The device comprises a distributing section and a wound body. The distributing portion can hold solutions each containing a sample to be distributed and has holding ends arranged in a predetermined matrix. The wound body includes a plane around which string-like or thread-like oblong basic members are so wound as to be parallel arrayed at column intervals and line intervals in such a way that the samples can come into contact with the holding ends. The samples are distributed at the column or line intervals.

Inventors:

TAJIMA HIDEJI (JP)
MIYASHITA YUKIKO (JP)
SEGAWA OSAMU (JP)

Application Number:

PCT/JP2004/009053

Publication Date:

December 29, 2004

Filing Date:

June 21, 2004

Export Citation:

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Assignee:

UNIVERSAL BIO RESEARCH CO LTD (JP)
TAJIMA HIDEJI (JP)
MIYASHITA YUKIKO (JP)
SEGAWA OSAMU (JP)

International Classes:

B01L3/02; C12M1/32; B01L3/00; (IPC1-7): G01N33/53; G01N33/543; G01N35/02; G01N37/00; C12N15/00; C12Q1/68; C12M1/00

Domestic Patent References:

WO2002063300A1	2002-08-15
WO2001053831A1	2001-07-26
WO2003100421A1	2003-12-04

Foreign References:

JP2003107083A	2003-04-09
JP2002286727A	2002-10-03
JP2002540380A	2002-11-26
JP2001099847A	2001-04-13
JP2004093558A	2004-03-25
US5807522A	1998-09-15
JPH11187900A	1999-07-13
US6221653B1	2001-04-24
US5744305A	1998-04-28

Other References: