Title:
SANDWICH PANEL, METHOD OF FORMING CORE MATERIAL FOR SANDWICH PANEL, AND METHOD OF FORMING SANDWICH PANEL
Document Type and Number:
WIPO Patent Application WO/2010/050242
Kind Code:
A1
Abstract:
A light weight sandwich panel which, as a whole, has high rigidity against bending and shearing and in which a core material has high rigidity against compression.
A sandwich panel comprising two resin skin material sheets and a thermoplastic resin core material sandwiched between the two resin skin material sheets and planarly adhered thereto. The thermoplastic resin core material consists of a foam resin and has openings formed in at least one surface of the core material. The openings extend inward and have recesses for forming cavities in the thermoplastic resin core material in such a manner that the cavities are closed by the skin material sheets. The number of recesses and the total area of the openings are determined in such a manner that the planar adhesion of the thermoplastic resin core material to the skin material sheets is successfully maintained and that a solid section of the foam resin of the thermoplastic resin core material effectively supports a compression load acting in the direction of the thickness of the thermoplastic resin core material.
Inventors:
SUMI, Takehiko (KYORAKU CO, LTD 1-1-5, Higashinihonbashi, Chuou-k, Tokyo 04, 〒1030004, JP)
鷲見武彦 (〒04 東京都中央区東日本橋１－１－５キョーラク株式会社内 Tokyo, 〒1030004, JP)
NAGAI, Sumio (KYORAKU CO, LTD TECHNICAL RESEARCH DEPARTMENT, 1-1-37, Fukaminishi, Yamato-sh, Kanagawa 18, 〒2420018, JP)
鷲見武彦 (〒04 東京都中央区東日本橋１－１－５キョーラク株式会社内 Tokyo, 〒1030004, JP)
NAGAI, Sumio (KYORAKU CO, LTD TECHNICAL RESEARCH DEPARTMENT, 1-1-37, Fukaminishi, Yamato-sh, Kanagawa 18, 〒2420018, JP)
Application Number:
JP2009/005807
Publication Date:
May 06, 2010
Filing Date:
October 31, 2009
Export Citation:
Assignee:
KYORAKU CO.,LTD (598-1, Tatsumae-cho Nakadachiuri-sagaru,Karasumadori, Kamigyo-ku, Kyoto-sh, Kyoto 12, 〒6020912, JP)
キョーラク株式会社 (〒12 京都府京都市上京区烏丸通中立売下ル龍前町５９８番地の１ Kyoto, 〒6020912, JP)
SUMI, Takehiko (KYORAKU CO, LTD 1-1-5, Higashinihonbashi, Chuou-k, Tokyo 04, 〒1030004, JP)
鷲見武彦 (〒04 東京都中央区東日本橋１－１－５キョーラク株式会社内 Tokyo, 〒1030004, JP)
キョーラク株式会社 (〒12 京都府京都市上京区烏丸通中立売下ル龍前町５９８番地の１ Kyoto, 〒6020912, JP)
SUMI, Takehiko (KYORAKU CO, LTD 1-1-5, Higashinihonbashi, Chuou-k, Tokyo 04, 〒1030004, JP)
鷲見武彦 (〒04 東京都中央区東日本橋１－１－５キョーラク株式会社内 Tokyo, 〒1030004, JP)
International Classes:
B32B27/00; B32B3/30; B32B5/18; B60R5/04
Attorney, Agent or Firm:
OKA, Kiyoshi (T's buidling 8th Floor, 1-22-9 Nakagawachuo Tsuzuki-ku Yokohama-sh, Kanagawa 03, 〒2240003, JP)
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