Title:
SAPPHIRE POLISHING SLURRY AND SAPPHIRE POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/136387
Kind Code:
A1
Abstract:
Disclosed is a polishing slurry for sapphire polishing that is capable of obtaining polishing speeds and smooth surfaces during the polishing of sapphire substrates that are equivalent to or better than in prior polishing processes even if the number of polishers and polishing hours are reduced. Also disclosed is a sapphire substrate polishing method. The slurry includes alumina abrasives and has a pH adjusted to the range of 10.0 to 14.0, and the sapphire is polished by means of the CMP technique by applying said slurry. The aforementioned alumina abrasives more preferably include at least α-alumina, and the content thereof is more preferably 0.01 to 50 wt%. The mean particle size of the aforementioned alumina abrasives is preferably 0.05 to 10 μm.
Inventors:
HOSOI Daisuke (6-17-13, Higashinarashino, narashino-shi, Chiba 01, 〒2750001, JP)
細井 大祐 (〒01 千葉県習志野市東習志野６丁目１７番１３号 株式会社バイコウスキージャパン内 Chiba, 〒2750001, JP)
細井 大祐 (〒01 千葉県習志野市東習志野６丁目１７番１３号 株式会社バイコウスキージャパン内 Chiba, 〒2750001, JP)
Application Number:
JP2011/060684
Publication Date:
November 03, 2011
Filing Date:
April 27, 2011
Export Citation:
Assignee:
Baikowski Japan Co., Ltd. (6-17-13, Higashinarashino Narashino-shi, Chiba 01, 〒2750001, JP)
株式会社バイコウスキージャパン (〒01 千葉県習志野市東習志野６丁目１７番１３号 Chiba, 〒2750001, JP)
HOSOI Daisuke (6-17-13, Higashinarashino, narashino-shi, Chiba 01, 〒2750001, JP)
株式会社バイコウスキージャパン (〒01 千葉県習志野市東習志野６丁目１７番１３号 Chiba, 〒2750001, JP)
HOSOI Daisuke (6-17-13, Higashinarashino, narashino-shi, Chiba 01, 〒2750001, JP)
International Classes:
B24B37/00; H01L21/304
Attorney, Agent or Firm:
HIRAISHI Toshiko (1-18-15, Nishi-ShinbashiMinato-Ku, Tokyo 03, 〒1050003, JP)
Download PDF:
Claims: