Title:
SAPPHIRE SUBSTRATE POLISHING AGENT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/043088
Kind Code:
A1
Abstract:
Provided is a sapphire substrate polishing agent composition with which a high-precision polished surface free from surface defects such as scratches can be obtained at a high polishing speed. The sapphire substrate polishing agent composition contains, as components, inorganic polishing particles, a polishing accelerator, and water. The inorganic polishing particles are alumina particles, the polishing accelerator is an organic carboxylic acid-based chelating compound, and the pH is 9.0-13.0.
Inventors:
YAMAGUCHI YOSHINOBU (JP)
NAITO KENJI (JP)
HORIMOTO SANAKI (JP)
NAITO KENJI (JP)
HORIMOTO SANAKI (JP)
Application Number:
PCT/JP2015/075423
Publication Date:
March 24, 2016
Filing Date:
September 08, 2015
Export Citation:
Assignee:
YAMAGUCHI SEIKEN KOGYO KK (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| WO2014032012A1 | 2014-02-27 | |||
| WO2009151120A1 | 2009-12-17 | |||
| WO2011136387A1 | 2011-11-03 |
Foreign References:
| JP2014049633A | 2014-03-17 | |||
| JPH0770553A | 1995-03-14 | |||
| JPH04363385A | 1992-12-16 | |||
| JP2000135673A | 2000-05-16 | |||
| JP2005205542A | 2005-08-04 | |||
| JP2010502455A | 2010-01-28 | |||
| JP2003136406A | 2003-05-14 |
Attorney, Agent or Firm:
NISHIJIMA Takaki et al. (JP)
Takayoshi Nishijima (JP)
Takayoshi Nishijima (JP)
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