SAW DEVICE AND METHOD OF MANUFACTURE THEREOF

Title:

SAW DEVICE AND METHOD OF MANUFACTURE THEREOF

Document Type and Number:

WIPO Patent Application WO/2001/089084

Kind Code:

A1

Abstract:

A small multichip package is provided which includes a plurality of SAW elements of different frequency characteristics in a single package. A plurality of SAW elements are bonded face down to a package so that a line along which the SAW elements are aligned may be substantially perpendicular to the direction in which ultrasonic waves are applied.

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Inventors:

CHUJO RIEKO (JP)

Application Number:

PCT/JP2001/003864

Publication Date:

November 22, 2001

Filing Date:

May 09, 2001

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Assignee:

TOSHIBA KK (JP)
CHUJO RIEKO (JP)

International Classes:

H03H3/08; H03H9/05; H03H9/10; (IPC1-7): H03H3/08; H05K3/34

Foreign References:

JPH08330880A	1996-12-13
JPH1140942A	1999-02-12
JPH10223694A	1998-08-21

Other References:

QING TAN ET AL.: "Thermosonic flip-chip bonding using longitudinal ultrasonic vibration", 1997 47TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 18-21 MAY 1997, 18 May 1997 (1997-05-18), pages 1128 - 1133
See also references of EP 1292022A4

Attorney, Agent or Firm:

Suzuye, Takehiko c/o SUZUYE & SUZUYE 7-2 (Kasumigaseki 3-chome Chiyoda-ku, Tokyo, JP)

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