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Title:
SAW WIRE
Document Type and Number:
WIPO Patent Application WO/2011/158834
Kind Code:
A1
Abstract:
Disclosed is a saw wire which comprises: a steel wire (11) comprising a base steel wire (11a) having a given composition; abrasive grains (13) adhered to the steel wire (11) by means of an adhesion part (12); and an intermetallic compound (15) formed at the interface between the abrasive grains (13) and the adhesion part (12). The base steel wire (11) has a tensile strength of 3,500 MPa or higher, and the adhesion part (12) comprises a Sn-based solder containing Zn or Ag.

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Inventors:
MORITA MITSURU (JP)
TARUI TOSHIMI (JP)
SAKAMOTO HIROAKI (JP)
YASHIRO HIROKATSU (JP)
KOSAKA MAKOTO (JP)
Application Number:
PCT/JP2011/063603
Publication Date:
December 22, 2011
Filing Date:
June 14, 2011
Export Citation:
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Assignee:
NIPPON STEEL CORP (JP)
MORITA MITSURU (JP)
TARUI TOSHIMI (JP)
SAKAMOTO HIROAKI (JP)
YASHIRO HIROKATSU (JP)
KOSAKA MAKOTO (JP)
International Classes:
B24D11/00; B23K35/26; B24D3/00; B24D3/06; C22C13/00; C22C38/00; C22C38/34; C22C38/54; B24B27/06; C21D8/06; C21D9/24; C21D9/52
Domestic Patent References:
WO2009084811A12009-07-09
Foreign References:
JP2008221406A2008-09-25
JPS62193777A1987-08-25
JP2004261889A2004-09-24
JP2002361566A2002-12-18
JP2009131872A2009-06-18
JP2009131871A2009-06-18
JPH0691538A1994-04-05
JP2009066689A2009-04-02
Other References:
None
See also references of EP 2583792A4
Attorney, Agent or Firm:
KOKUBUN, Takayoshi (JP)
Takayoshi Kokubu (JP)
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