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Patent Searching and Data


Title:
SCALE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2024/050884
Kind Code:
A1
Abstract:
A scale assembly, comprising positioning members (1) and a caliper (2). Each positioning member (1) comprises a first support portion (111) and a second support portion (112). Each positioning member (1) is provided with a connection hole (12), wherein the distance from the connection hole to an end portion of the first support portion (111) away from the positioning member (1) and the distance from the connection hole to an end portion of the second support portion (112) away from the positioning member (1) are both equal to the radius of a wafer. A vernier structure (23) of the caliper (2) is slidably connected to a main scale structure (21) in a first direction in which the main scale structure (21) is provided with marks, and the main scale structure (21) is rotatably connected to the connection holes (12). The assembly facilitates an installer to control a relative position between an object to be measured (30) and a wafer, so that said object (30) is located at a suitable position in which said object does not rub with the wafer, and the quality of produced wafers can be improved.

Inventors:
ZHU HONGHUA (CN)
LI GUOLIANG (CN)
HE GUOPING (CN)
Application Number:
PCT/CN2022/121310
Publication Date:
March 14, 2024
Filing Date:
September 26, 2022
Export Citation:
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Assignee:
TAIWAN SEMICONDUCTOR MFG CO LTD (CN)
TSMC CHINA COMPANY LTD (CN)
International Classes:
G01B5/14
Foreign References:
CN206430653U2017-08-22
CN105783629A2016-07-20
CN102589396A2012-07-18
CN203489800U2014-03-19
GB2093753A1982-09-08
JP2001143984A2001-05-25
FR1388405A1965-02-05
US5275521A1994-01-04
Attorney, Agent or Firm:
BEIJING EAST IP LTD. (CN)
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