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Patent Searching and Data


Title:
SCATTERING PLATE, GRINDING WHEEL, AND GRINDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/004973
Kind Code:
A1
Abstract:
A scattering plate (4) for scattering a supplied solution supplied via a supply tubing is characterized by the following: being provided with a planar member (41) that can be disposed at a position facing an opening end of the supply tubing so that the thickness direction is substantially parallel to a direction (D1) of supply of the supplied solution and so as to rotate about a rotational axis substantially parallel to the thickness direction; being provided, in the planar member (41), with a scattering hole (42) through which the supplied solution is able to pass and which perforates in the thickness direction at a location other than a rotational center (O) of the planar member (41); and a wall surface (421) located on the rear side of a direction (D2) of rotation in the scattering hole (42) being inclined so that a wall surface end section (421A) located rearmost in the direction of rotation on a facing surface (411) side facing the supply tubing (3) is located more in front in the direction (D2) of rotation than a wall surface end section (421B) located rearmost in the direction of rotation on a non-facing surface (412) side.

Inventors:
NISHIMURA YOSHINOBU (JP)
Application Number:
PCT/JP2014/061751
Publication Date:
January 15, 2015
Filing Date:
April 25, 2014
Export Citation:
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Assignee:
SUMCO TECHXIV CORP (JP)
International Classes:
B24B57/02; B24B55/02; B24D7/00; B24D7/10
Foreign References:
JPH0683260U1994-11-29
JPH0623674A1994-02-01
JPH0938866A1997-02-10
JPH0699360A1994-04-12
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Bottom intellectual property office of patent business corporation Tatsuyuki (JP)
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