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Patent Searching and Data


Title:
SCRAPER DEVICE, SOLDER PASTE PRINTING APPARATUS AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2022/156528
Kind Code:
A1
Abstract:
Disclosed are a scraper device, a solder paste printing apparatus and a manufacturing method for a printed circuit board assembly. The scraper device comprises a knife rest assembly (110) and a blade (120), wherein the blade (120) is provided with a fixed end and a free end, the fixed end of the blade (120) is connected to the knife rest assembly (110), an included angle between the free end of the blade (120) and a steel mesh (200) is any angle from 46 to 56 degrees, and the steel mesh (200) is placed on a surface of a circuit board (400) to be printed. The device avoids the situation of the filled amount of solder paste being insufficient.

Inventors:
DING JIANGUO (CN)
SUN LEI (CN)
LIANG ZHIGANG (CN)
CHEN ZHILIN (CN)
ZHANG LONGJIANG (CN)
Application Number:
PCT/CN2022/070119
Publication Date:
July 28, 2022
Filing Date:
January 04, 2022
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
B41F15/44
Foreign References:
CN201703017U2011-01-12
CN202278821U2012-06-20
CN209920717U2020-01-10
US4919970A1990-04-24
JP2005343116A2005-12-15
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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