Title:
SCRIBING APPARATUS AND SCRIBING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/098058
Kind Code:
A1
Abstract:
A small-sized brittle material substrate is scribed with excellent workability.
A plurality of brittle material substrates (107a-107i) are respectively aligned and arranged on a table (106) with aligning pins (109). A recipe data table is previously stored for each brittle material substrate. Based on the recipe data table, the brittle material substrates and a scribe head are relatively moved and inner cut scribing and outer cut scribing are performed to each substrate. Thus, the scribing operation can be automatically performed to the plurality of substrates at one time.
Inventors:
SOYAMA, Masanobu (2-12-12, Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
Application Number:
JP2010/001130
Publication Date:
September 02, 2010
Filing Date:
February 22, 2010
Export Citation:
Assignee:
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. (2-12-12, Minami-Kaneden Suita-cit, Osaka 44, 〒5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 〒5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 〒5640044, JP)
International Classes:
B28D5/00; B28D1/24; C03B33/037
Attorney, Agent or Firm:
OKAMOTO, Yoshiki (Shori Building 7-7-19, Takaidahondori, Higashi-Osaka-sh, Osaka 66, 〒5770066, JP)
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