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Patent Searching and Data


Title:
SEALANT, BAG FOR TRANSPORTATION OF SILICON MATERIAL, AND PACKAGE OF SILICON MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/039922
Kind Code:
A1
Abstract:
A packaging material used in this bag for transportation of a silicon material is a laminate of a first resin base layer, a barrier layer, a second resin base layer, a resin layer, and a sealant layer, which are put on top of each other in this order, wherein the indentation elastic modulus (MPa) of the resin layer is lower than the indentation elastic modulus (MPa) of each of the first and second resin base layers by one or more orders of magnitude, the indentation elastic modulus (MPa) of the sealant layer is lower than the indentation elastic modulus (MPa) of the first resin base layer and the indentation elastic modulus (MPa) of the second resin base layer by one or more orders of magnitude, and the difference between the indentation elastic modulus (MPa) of the first resin base layer and the indentation elastic modulus (MPa) of the second resin base layer is less than the difference between the indentation elastic modulus (MPa) of the second resin base layer and the indentation elastic modulus (MPa) of the resin layer.

Inventors:
NAKAJIMA HIROYOSHI (JP)
MOTAI KATSUYUKI (JP)
TACHIKAWA YUKA (JP)
MIZOSHIRI MAKOTO (JP)
SATO KAZUSHI (JP)
Application Number:
PCT/JP2020/032431
Publication Date:
March 04, 2021
Filing Date:
August 27, 2020
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B65D65/40; B32B7/12; B32B27/00; B32B27/34; B32B27/36; B65D30/02; B65D77/04; C09J123/06
Domestic Patent References:
WO2018101464A12018-06-07
Foreign References:
JP2009202927A2009-09-10
JP2012223942A2012-11-15
JP2004148633A2004-05-27
JP2012076291A2012-04-19
JP2017013485A2017-01-19
JP2016054148A2016-04-14
JPH0470629B21992-11-11
JP2013136405A2013-07-11
JP2004148633A2004-05-27
JP2012223942A2012-11-15
Other References:
See also references of EP 4023566A4
Attorney, Agent or Firm:
OTA Masataka (JP)
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