SEALANT PASTE AND SEALING METHOD

Title:

SEALANT PASTE AND SEALING METHOD

Document Type and Number:

WIPO Patent Application WO/2013/137130

Kind Code:

A1

Abstract:

Provided are a sealant paste and a sealing method whereby it is possible to shorten the sealing/forming cycle even when an aqueous medium is used. The sealant paste is for molding and sealing a device, and contains a copolymer polyamide resin and an aqueous medium. The copolymer polyamide resin may be crystalline, and the melting point or softening point of the copolymer polyamide resin may be 75-160° C. The copolymer polyamide resin may be a multi-component copolymer, e.g., a binary copolymer or a ternary copolymer. In addition, the copolymer polyamide resin may contain a unit derived from a long-chain component (at least one component selected from among C9-17 lactam and amino C9-17 alkane carboxylic acid) that has a C8-16 alkylene group. The sealant paste may additionally contain a thickening agent (for example, a (meth)acrylic acid polymer).

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Inventors:

ARITA HIROAKI (JP)
NAKAIE YOSHIKI (JP)
MUTSUDA MITSUTERU (JP)

Application Number:

PCT/JP2013/056424

Publication Date:

September 19, 2013

Filing Date:

March 08, 2013

Export Citation:

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Assignee:

DAICEL EVONIK LTD (JP)

International Classes:

C08L77/00; C08G69/02; H01L21/56; H01L23/29; H01L23/31; H05K3/28

Foreign References:

JPS63189458A	1988-08-05
JP2010010669A	2010-01-14
JP2006339057A	2006-12-14
JP2012087292A	2012-05-10
JP2012067176A	2012-04-05
JP2012089750A	2012-05-10
JP2000133665A	2000-05-12
JP2008282906A	2008-11-20
JP2009099417A	2009-05-07
JP2009099805A	2009-05-07
JP2001234125A	2001-08-28

Other References: