Title:
SEALANT PASTE AND SEALING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/137130
Kind Code:
A1
Abstract:
Provided are a sealant paste and a sealing method whereby it is possible to shorten the sealing/forming cycle even when an aqueous medium is used. The sealant paste is for molding and sealing a device, and contains a copolymer polyamide resin and an aqueous medium. The copolymer polyamide resin may be crystalline, and the melting point or softening point of the copolymer polyamide resin may be 75-160° C. The copolymer polyamide resin may be a multi-component copolymer, e.g., a binary copolymer or a ternary copolymer. In addition, the copolymer polyamide resin may contain a unit derived from a long-chain component (at least one component selected from among C9-17 lactam and amino C9-17 alkane carboxylic acid) that has a C8-16 alkylene group. The sealant paste may additionally contain a thickening agent (for example, a (meth)acrylic acid polymer).
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Inventors:
ARITA HIROAKI (JP)
NAKAIE YOSHIKI (JP)
MUTSUDA MITSUTERU (JP)
NAKAIE YOSHIKI (JP)
MUTSUDA MITSUTERU (JP)
Application Number:
PCT/JP2013/056424
Publication Date:
September 19, 2013
Filing Date:
March 08, 2013
Export Citation:
Assignee:
DAICEL EVONIK LTD (JP)
International Classes:
C08L77/00; C08G69/02; H01L21/56; H01L23/29; H01L23/31; H05K3/28
Foreign References:
JPS63189458A | 1988-08-05 | |||
JP2010010669A | 2010-01-14 | |||
JP2006339057A | 2006-12-14 | |||
JP2012087292A | 2012-05-10 | |||
JP2012067176A | 2012-04-05 | |||
JP2012089750A | 2012-05-10 | |||
JP2000133665A | 2000-05-12 | |||
JP2008282906A | 2008-11-20 | |||
JP2009099417A | 2009-05-07 | |||
JP2009099805A | 2009-05-07 | |||
JP2001234125A | 2001-08-28 |
Other References:
See also references of EP 2826818A4
Attorney, Agent or Firm:
KUWATA Mitsuo et al. (JP)
Atsuo Kuwata (JP)
Atsuo Kuwata (JP)
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