SEALANT RESIN COMPOSITION AND USE OF SAME

WIPO Patent Application WO/2024/053644

A1

The purpose of the present invention is to achieve a sealant resin composition which has good heat seal strength and excellent resistance to whitening during stretching, and which still has the good heat seal strength even after a heat treatment. The present invention relates to a sealant resin composition (X) which contains a 1-butene/ethylene copolymer (A) that satisfies a specific requirement and a propylene polymer (B), and which satisfies the requirement (X1) and the requirement (X1-2) described below. Requirement (X1): The Shore D hardness as measured in accordance with ASTM D2240 is within the range of 44 to 80. Requirement (X1-2): The melt flow rate (MFR) as measured at 230°C under a load of 2.16 kg in accordance with ASTM D1238 is within the range of 0.1 g/10 minutes to 100 g/10 minutes.

JPH04359085	COATING AGENT FOR NONCOMBUSTIBLE SHEET MATERIAL AND SEMIMETALLIC GASKET
JPS5548235	THERMOPLASTIC POLYMER COMPOSITION WITH ELASTICITY
JP5419607	Sealant material, cover tape, and packaging for transporting electronic components

MIZUMA TAKAHIRO (JP)
ITAKURA MANABU (JP)
KAMIYA NOZOMI (JP)
NODA KIMINORI (JP)
EGAWA MAKOTO (JP)

PCT/JP2023/032399

March 14, 2024

September 05, 2023

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MITSUI CHEMICALS INC (JP)

C09K3/10; B32B27/32; C08F210/16; C08J5/18; C08L23/08; C08L23/10; H01M50/105; H01M50/119; H01M50/121; H01M50/124; H01M50/131; H01M50/134

WO2014042249A1	2014-03-20
WO1998033850A1	1998-08-06
WO2017213216A1	2017-12-14
WO2022191039A1	2022-09-15

US20150051350A1	2015-02-19
JP2014500340A	2014-01-09
JP2018522784A	2018-08-16
JP2013157286A	2013-08-15

SSINPAT PATENT FIRM (JP)

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