Title:
SEALED CONTACT DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/136730
Kind Code:
A1
Abstract:
The purpose of this invention is to provide a sealed contact device that has a low component count and can be manufactured with high productivity. To that end, in this sealed contact device, a flange ring (32a) that extends outwards from the edge of a bottom opening in a metal case (32) is welded to the top surface of a yoke plate (37), forming a single unit with an internal space, and in said internal space, a fixed contact (33a) and a movable contact (48a) face each other so as to be able to contact each other and move away from each other. In particular, a protruding ring (32c) provided along the bottom surface of the flange ring (32a) is joined to the top surface of the yoke plate (37) via resistance welding.
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Inventors:
SHIMA HIROMI (JP)
MORI MASAKI (JP)
OKAMOTO TAKUMA (JP)
MORI MASAKI (JP)
OKAMOTO TAKUMA (JP)
Application Number:
PCT/JP2014/071068
Publication Date:
September 17, 2015
Filing Date:
August 08, 2014
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01H50/54; H01H49/00
Domestic Patent References:
| WO2012157175A1 | 2012-11-22 |
Foreign References:
| JP2002075108A | 2002-03-15 | |||
| JPH0631456A | 1994-02-08 | |||
| JP2002075108A | 2002-03-15 |
Other References:
See also references of EP 3118880A4
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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