SEALED LETTER PREPARATION DEVICE AND ENVELOPE PAPER

Title:

SEALED LETTER PREPARATION DEVICE AND ENVELOPE PAPER

Document Type and Number:

WIPO Patent Application WO/2012/057202

Kind Code:

A1

Abstract:

A sealed letter preparation device that seals by folding enveloped paper, which is provided with a pressure-sensitive adhesive, and contents, can be sealed with pressure bonding rollers of a smaller size than is conventional. The pressure-sensitive adhesive (106) is provided on both edge portions in the width direction of the envelope paper (100), and remoistening glue (107) is provided inside of the both edge portions. Water is added to the remoistening glue upon forming an envelope (50) by folding the envelope paper wrapping the contents, the entire surface of the envelope is bonded with the remoistening glue by applying pressure with low-pressure rollers, and the pressure-sensitive adhesive (106) is made to bond by applying pressure to the both edge portions of the envelope (50) with only top-and-bottom-grouped left-and-right pairs of pressure rollers (80,80) being narrower in width. Since the high pressure required to bond the pressure-sensitive adhesive need only be applied to the both edge portions of the envelope, the pressure rollers (80) may be small.

Inventors:

WAKATABI TADAYUKI (JP)
KATADA KAZUHIRO (JP)

Application Number:

PCT/JP2011/074667

Publication Date:

May 03, 2012

Filing Date:

October 26, 2011

Export Citation:

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Assignee:

RISO KAGAKU CORP (JP)
WAKATABI TADAYUKI (JP)
KATADA KAZUHIRO (JP)

International Classes:

B31B21/60; B31B27/60; B31B70/00; B42D15/08; B43M3/04; B43M5/04; B65D27/10; B65D27/16

Foreign References:

JP2002528361A	2002-09-03
JPS5050100A	1975-05-06
JP2006082388A	2006-03-30
JP2006272944A	2006-10-12
JP3491921B2	2004-02-03
JP3343165B2	2002-11-11
JP2001322377A	2001-11-20
JP2002526305A	2002-08-20
JP2521498B2	1996-08-07

Other References: